Session: K16-02: HEAT TRANSFER IN ELECTRONIC EQUIPMENT II

Paper Number: 131517

131517 - Optimization of Thermal Management in Power Electronics by the Design of Split Channel Cooling Systems Through Numerical Simulations 

Abstract: 

In the field of power electronics, managing high thermal loads efficiently is extremely cruicial to ensure reliable operation and enhancing the operational lifecycle and efficiency This study presents a numerical analysis of advanced cooling techniques using split macrochannel cooling systems incorporating crossflow, specifically tailored for power electronics. Using ANSYS CFX, three-dimensional numerical investigation of fluid flow and heat transfer performance of the primary and the secondary sides of the power converters with the novel split channel configurations are studied.

Various channel designs, ranging from single to multiple split configurations (dual, quadruple, and hexa-split), in addition to channel size (3mm - 6mm) , coolant inlet velocity(0.5 m/s to 6 m/s), and the incorporation of transverse flow to optimize heat dissipation are examined. Compared to a traditional straight channel, the split channel with the same hydraulic diameter configuration exhibited an average ~25% lower pressure drop.  At the highest power loss configuration, a 33% reduction in  temperature is achieved with optimized split channel and crossflow designs. This reduction is primarily attributed to the targetted surface area increase for heat disspiation at the hot spot regions and the induced turbulence in the coolant water flow, which collectively enhance the convective heat transfer coefficient.

Our findings underscore the superiority of split channel configurations, especially when integrated with crossflow, in addressing the critical cooling requirements of power electronics systems. Thus, the insights gained from this research are expected to significantly influence future design considerations and operational strategies in the domain of high thermal load power electronics cooling.

Presenting Author: Hooman Taghavi University of South Carolina

Presenting Author Biography: Ph.D. Candidate in Mechanical Engineering

Authors:

Hooman Taghavi University of South Carolina
Sowmya Raghu UofSC
Jamil Khan University of South Carolina