Session: K8-P3: PANEL ON FUNDAMENTALS OF SEMICONDUCTOR THERMAL MANAGEMENT

Paper Number: 130939

130939 - Thermal Engineering of Materials for Advanced Electronics Packaging 

Abstract: 

Thermal effects limit the maximum power of advanced computing solutions as elevated can drastically reduce system lifetime. This is particularly challenging in the advanced packages that are being developed for high performance computing systems and for power electronics. In these systems, a combination of high thermal conductivity materials and thermally isolating materials are required to get heat out of the device without impacting delicate components in the system, such as the memory. This presentation will introduce research in my group focused on engineering materials with targeted thermal conductivity performance, switchable materials where the thermal transport can actively tuned, and techniques we are developing to understand the thermal properties in the unique formfactors required for advanced electronics packaging. As an example, thermally conductive, electrically insulating materials are required at various locations within the package for improved heat dissipation. But this combination of properties is not readily available in naturally occurring materials and, additional constraints on form factor and mechanical properties, make engineering these materials challenging. For the thin film form factor of interest for flexible substrates in wearable devices, our team developed a new technique to quantify thermal transport leveraging concepts from the Angstrom method and updating the technique with modern tools including infrared thermal imaging and physics-informed neural networks for robust data analysis. Overall, new applications within advanced packaging of electronic devices drive the development of new thermally-engineered materials and new metrology techniques to understand performance.

Presenting Author: Amy Marconnet Purdue University

Presenting Author Biography: Professor Amy Marconnet is an associate professor of Mechanical Engineering and associate professor of Materials Engineering (by Courtesy), as well as a Perry Academic Excellence Scholar, at Purdue University. She received a B.S. in Mechanical Engineering from the University of Wisconsin – Madison in 2007, and an M.S. and a PhD in Mechanical Engineering at Stanford University in 2009 and 2012, respectively. Her dissertation focused on thermal phenomena in nanostructured materials. She then worked briefly as a postdoctoral associate at the Massachusetts Institute of Technology, before joining the faculty at Purdue University in August 2013. Her work has won outstanding paper awards at ITherm 2012, InterPACK 2017, ITherm 2019, and ITherm 2023. In 2017, she won the Woman in Engineering Award from the ASME Electronics & Photonics Packaging Division (EPPD). In 2020, she won the Bergles-Rohsenow Young Investigator Award in Heat Transfer and the Outstanding Graduate Student Mentor from the Official Mechanical Engineering Graduate Association (OMEGA) and the College of Engineering. She recently won a Humboldt Fellowship for Experienced Researchers and conducted research at Karlsruhe Institute of Technology in the 2021-22 academic year.

Authors:

Amy Marconnet Purdue University