Session: K8-P3: PANEL ON FUNDAMENTALS OF SEMICONDUCTOR THERMAL MANAGEMENT

Paper Number: 142190

142190 - Challenges and Opportunities for Thermal Management of Heterogenous Integrated Systems 

Abstract: 

Disaggregating a system on a chip into chiplets and then aggregating those chiplets into a single package is known as heterogeneous integration. This technology has become a cornerstone in advanced packaging, enabling a More-Than-Moore approach that promotes increased performance, lower power consumption, lower cost, improved yield, and increased functionality. The CHIPS Act, aimed at revitalizing semiconductor fabrication in the US, is expected to accelerate the adoption of heterogeneous integration. However, this integration brings significant thermal management challenges due to the integrated components' diverse thermal/mechanical properties and heat loads.

Key thermal management challenges in implementing heterogeneous integration are the heat load of different dies stacked together and thermal cross-talks. Addressing this challenge requires innovative integration and thermal management techniques to improve heat dissipation, where co-design is necessary. Furthermore, the trend towards smaller form factors and higher power densities exacerbates thermal challenges, necessitating the development of advanced cooling solutions. Emerging technologies such as in-chip two-phase, single-phase microchannel, and immersion cooling offer promising avenues for efficiently managing heat in heterogeneous integrated chips.

In this talk, I will discuss the need for heterogeneous integration and the challenges and barriers associated with the industry-wide implementation of these chips. I will also introduce some of the work being done at the Nanoscale Energy and Interfacial Transport Lab at the University of Maryland, including the implementation of direct-to-chip evaporative cooling, two-phase immersion cooling for servers, direct-to-chip thin-film boiling, encapsulated PCM slurry microchannel cooling, and near-junction diamond coatings and diamond substrate to reduce junction hotspots.

Presenting Author: Damena Agonafer University of Maryland- College Park

Presenting Author Biography: Professor Agonafer’s research interest is at the intersection of thermal-fluid sciences, interfacial transport phenomena, and renewable energy. He is focused on developing novel materials and systems for the thermal management of power and microelectronic systems and for thermochemical and electrochemical energy storage applications. He aims to achieve transformational technological changes by tuning and controlling solid-liquid-vapor interactions at micro-/nano length scales. Specific focus areas include developing novel materials and micro-/nanostructures for phase change heat transfer, thermochemical energy storage, and interfacial transport phenomena. Applications of his work include cooling high-powered electronics, battery thermal management, and data center cooling and improving the efficiency of HVAC systems. Currently, he is working on several ongoing projects, including two-phase electronics cooling, the development of physics-informed neural network (PINN) models for GaN devices and data centers, and the development of composite phase change materials for thermal regulation of high-powered devices.

He is a recipient of the Google Research Award, Sloan Research Fellowship Award, Cisco Research Award, NSF CAREER Award, ASME Early Career Award, and ASME K-16 Outstanding Early Faculty Career in Thermal Management Award. He was also one of 85 early-career engineers in the US selected to attend the National Academy of Engineering’s 26th annual US Frontiers of Engineering symposium.

Authors:

Damena Agonafer University of Maryland- College Park