Session: K8-P3: PANEL ON FUNDAMENTALS OF SEMICONDUCTOR THERMAL MANAGEMENT

Paper Number: 142266

142266 - Thermal Management of 3d High-Power Chip Stacks to Enable Advanced Semiconductor Packaging 

Abstract: 

Current global trends in the generation, transmission, and processing of data rest on the continued advances in the functionality of semiconductor devices that have thermally constrained performance and efficiency.  In particular, vertical stacking of semiconductor dies holds promise to significantly enhance computational performance for applications demanding high bandwidth, enabled by advances in chip manufacturing and assembly. However, the ability to effectively dissipating heat from within these 3D high-power chip stacks remains a formidable obstacle to their broader adoption. This talk will review several examples of pioneering research that has led to breakthrough strategies for advanced semiconductor packaging in the Cooling Technologies Research Center (CTRC) at Purdue University and the SRC Center for Heterogeneous Integration Research in Packaging (CHIRP). These include a variety of embedded cooling technologies specifically designed for semiconductor packages, such as passive novel heat pipes capable of extracting high powers from a 100-micron gap in a die stack, co-design capabilities that can simultaneously address both power delivery and thermal regulation in advanced packaging, and new metrology for characterization of deeply buried thermal interfaces. These team efforts are dedicated to improving device reliability and performance by optimizing heat dissipation in compact electronic packages, highlighting the indispensable role of thermal management in diverse applications and environments. 

Presenting Author: Justin Weibel Purdue University

Presenting Author Biography: Justin A. Weibel is a Professor of the School of Mechanical Engineering at Purdue University and Director of the Cooling Technologies Research Center (CTRC), a graduated NSF I/UCRC that addresses research and development needs of companies and organizations in the area of high-performance heat removal from compact spaces. He received his PhD in 2012 and BSME in 2007, both from Purdue University. Dr. Weibel’s research group explores methodologies for prediction and control of heat transport to enhance the performance and efficiency of thermal management technologies and energy transfer processes. He has been a key contributor to the development of transformative cooling technologies supported by the DARPA TGP (2008-2012), DARPA ICECool (2013-2017), NAVSEA NEEC (2016-2018), ONR NEPTUNE (2015-2021), SRC CHIRP (2019-), ARPA-E ASCEND (2021-), and ARPA-E COOLERCHIPS (2023-) programs, in addition to numerous sponsored research projects that transition these technologies to industry. Dr. Weibel has supervised 36 PhD and 14 MS students, current and former, co-authored over 200 refereed journal and conference papers (h-index of 42). He has been recognized as an Outstanding Engineering Teacher and Outstanding Faculty Mentor in the College of Engineering at Purdue University. He recently received the 2020 ASME Electronic & Photonic Packaging Division (EPPD) Young Engineer Award, 2021 ASME K-16 Outstanding Early Faculty Career in Thermal Management Award, and in 2023 was elected a Fellow of the ASME. Dr. Weibel is on the IEEE ITherm Executive Committee (Conference General Chair in 2021) and is Associate Editor of the IEEE Transactions on Components Packaging and Manufacturing Technology.

Authors:

Justin Weibel Purdue University