Session: K8-P3: PANEL ON FUNDAMENTALS OF SEMICONDUCTOR THERMAL MANAGEMENT

Paper Number: 142364

142364 - Advancing Thermal Management With Ultra-High Thermal Conductivity Materials and Dynamic Controls 

Abstract: 

Thermal management represents the most critical challenge in electronics and energy systems. In this talk, I will highlight my group's recent efforts in creating new semiconductor materials and devices to push the boundaries of heat dissipation [1-6]. First, I'll discuss our efforts in developing a new class of semiconductors with ultra-high thermal conductivity and their integration with wide-bandgap GaN to enhance heat dissipation in power electronics. Notably, we have developed cubic boron arsenide (BAs) and boron phosphide with a thermal conductivity up to 1300 W/mK at room temperature, surpassing most common semiconductors and metals. We have also integrated BAs with GaN HEMTs [2], achieving a low thermal boundary resistance of GaN-BAs and superior cooling performance that outperforms diamond/SiC-substrate devices. Using self-assembly manufacturing and wafer-size processing [3], we have developed scalable, high-conductivity BAs-polymer interfaces for efficient cooling in LEDs and wearables. Moreover, our fundamental study has explored BAs as a showcase platform for the physics of high-order phonon anharmonicity [4] and non-perturbative quantum theory [5]. Finally, I’ll discuss our recent advances in developing the first high-performance and fully solid-state thermal transistor [6], which enables dynamic heat controls with high speeds over 1 MHz, tuning ratio over 1300%, and high reversibility over millions of cycles. References: [1] Science 361, 575-578 (2018). [2] Nature Electronics 4, 416-423 (2021). [3] Nature Communications 12, 1284 (2021). [4] Nature 612, 459-464 (2022). [5] Phys. Rev. B 108, L140302 (2023). [6] Science 382, 585 (2023).

Presenting Author: Yongjie Hu University of California, Los Angeles

Presenting Author Biography: Yongjie Hu is a Professor and Vice Chair in the Department of Mechanical and Aerospace Engineering at UCLA. His research group exploits interdisciplinary experimental and theoretical approaches to investigate materials transport mechanisms and device applications, pushing forward the technology frontiers in thermal management, sustainable energy, electronics, aerospace, and biomedicine. Before joining the UCLA faculty, he received Ph.D. degree from Harvard University and postdoctoral fellowship from the Massachusetts Institute of Technology. Prof Hu’s research has been recognized by diverse research societies, including the Alfred P. Sloan Research Fellow, Bergles-Rohsenow Young Investigator Award from the American Society of Mechanical Engineers, CAREER Award from the National Science Foundation, and Young Investigator Award from the U.S. Air Force Office of Scientific Research.

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